Critical factors affecting the 3D microstructural formation in hybrid conductive adhesive materials studied by X-ray nano-tomography.

Conductive adhesives are found favorable in a wide range of applications including a lead-free solder in micro-chips, flexible and printable electronics and enhancing the performance of energy storage devices. Composite materials comprised of metallic fillers and a polymer matrix are of great interest to be implemented as hybrid conductive adhesives. Here we investigated a cost-effective conductive adhesive material consisting of silver-coated copper as micro-fillers using synchrotron-based three-dimensional (3D) X-ray nano-tomography.