The corrosion and stress corrosion cracking (SCC) behaviors of 20#, X60, and X80 pipeline steels in a near-neutral pH environment were investigated by means of electrochemical measurement, immersion test, and interrupted slow strain rate tensile (SSRT) test. The propensity for SCC, as indicated by the stress threshold value for crack initiation, was found to be dependent on the type of steel microstructure. Cracks were initiated in the high-strength steel X80 at a stress less than its yield strength, whereas in the other lower-grade steels, the initiation of cracks occurred after the yielding point.
View Article and Find Full Text PDFThe electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An independently developed liquid-solid separation technology is applied to fabricate the diamond/Al composites with a graded distribution of diamond particles.
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