In the chemical-mechanical polishing (CMP) process, the abrasive particles in the polishing slurry tend to agglomerate easily and crystallize on the equipment surfaces during recycling, which can lead to poor wafer processing quality and additional tedious cleaning work. To overcome this issue, a simple and cost-effective self-cleaning surface preparation method has been developed. In this study, elastic and stretchable hydroxyl polydimethylsiloxane (PDMS-OH) was selected as the functional material, it was chelated with pentaerythritol tetra(3-mercapto propionate), and then 2-(perfluorooctyl)ethyl methacrylate was further grafted in situ to the polymer chains via a photoinduced thiol-ene click reaction.
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