Application of Chemical Metallization of Photopolymer Structures Additive Technology in the Production of Components for Electronic Devices.

In this paper, we studied the operability of various components of vacuum electronic devices manufactured using the novel chemical metallization of photopolymer 3D-printed structures technology (CMPS), which is being applied at the Institute of Applied Physics, Russian Academy of Sciences (IAP RAS), for operation from microwave to sub-terahertz ranges. The key feature of this production method is the 3D printing (SLA/DLP, MJM technologies) of products and their further metallization. The paper presents the main stages of the process of chemical copper plating of polymer bases in various electrodynamic systems with complex shapes.