Publications by authors named "Michael Tkadletz"

Low-melting metal alloys have gained renewed attention for additive manufacturing, energy storage and microelectronics. However, micro- and nanostructure characterisation demands highly sophisticated sample preparation. Here, we optimise the Ga-FIB preparation of atom probe tomography (APT) specimens for low melting SAC305 solder materials utilising different FESEM/FIB stage temperatures.

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To avoid hydrogen flaking in rail production, it is of crucial importance to understand the differences in hydrogen diffusion and trapping between different production steps. Therefore, as-cast unfinished material was compared with two finished rails, hot-rolled and head-hardened, using electron backscattered diffraction (EBSD), electrochemical permeation, and thermal desorption spectroscopy (TDS). A significant increase in dislocation density was in the head-hardened rail compared with the other material states.

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It is known that measurement parameters can significantly influence the elemental composition determined by atom probe tomography (APT). Especially results obtained by laser-assisted APT show a strong effect of the laser pulse energy on the apparent elemental composition. Within this study laser-assisted APT experiments were performed on CrN and thermally more stable (CrAl)N, comparing two different base temperatures (i.

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Microtip arrays, also called microtip coupons, are routinely used in atom probe tomography (APT) as specimen carriers. They are commercially available consumables, usually made of Si with high electrical conductivity, produced via dedicated shaping techniques. Their purpose is to act as a specimen mount after focused ion beam (FIB) based lift-out procedures.

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A major drawback of atom probe tomography (APT) experiments of complex samples is the demanding and rather time consuming specimen preparation via the lift-out process. It usually requires a skilled operator for focused ion beam (FIB) preparation, and frequently overbooked FIB workstations represent a major bottleneck in sample throughput. Within this work, the authors present an alternative approach for APT specimen preparation of functional films and coatings on Si substrates via anisotropic wet-chemical etching.

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