Evidence of speckle in extreme-UV lithography.

Based on reflective optics at 13.5 nm, extreme-UV lithography is the ultimate top-down technique to define structures below 22 nm but faces several challenges arising from the discrete nature of light and matter. Owing to the short wavelength, mask surface roughness plays a fundamental role in the increase of speckle pattern contrast, compromising the uniformity of the printed features.

Line edge roughness after development in a positive-tone chemically amplified resist of post-optical lithography investigated by Monte Carlo simulation and a dissolution model.

Line edge roughness (LER) of patterned features in chemically amplified (CA) resists is formed in the acid generation stage and expected to be moderated by the acid diffusion and development process. It is essential to obtain information on the limit of LER in order to realize next-generation lithographies such as electron beam or extreme ultraviolet. Here, we report for the first time a process simulator based on physical and chemical reaction mechanisms.