Hydrogenated amorphous silicon photonic device trimming by UV-irradiation.

A method to compensate for fabrication tolerances and to fine-tune individual photonic circuit components is inevitable for wafer-scale photonic systems even with most-advanced CMOS-fabrication tools. We report a cost-effective and highly accurate method for the permanent trimming of hydrogenated amorphous silicon photonic devices by UV-irradiation. Microring resonators and Mach-Zehnder-interferometers were utilized as photonic test devices.