Substrate-Free Transfer of Silicon- and Metallic-Based Strain Sensors on Textile and in Composite Material for Structural Health Monitoring.

New technologies to integrate electronics and sensors on or into objects can support the growth of embedded electronics. The method proposed in this paper has the huge advantage of being substrate-free and applicable to a wide range of target materials such as fiber-based composites, widely used in manufacturing, and for which monitoring applications such as fatigue, cracks, and deformation detection are crucial. Here, sensors are first fabricated on a donor substrate using standard microelectronic processes and then transferred to the host material by direct transfer printing.

An Improved Fabrication Technique for the 3-D Frequency Selective Surface based on Water Transfer Printing Technology.

Manufacturing an array of high-quality metallic pattern layers on a dielectric substrate remains a major challenge in the development of flexible and 3-D frequency selective surfaces (FSS). This paper proposes an improved fabrication solution for the 3-D FSS based on water transfer printing (WTP) technology. The main advantages of the proposed solution are its ability to transform complicated 2-D planar FSS patterns into 3-D structures while improving both manufacturing quality and production costs.

High performance of 3D silicon nanowires array@CrN for electrochemical capacitors.

Silicon nanowire (SiNW) arrays were coated with chromium nitride (CrN) for use as supercapacitor electrodes. The CrN layer of different thicknesses was deposited onto SiNWs using bipolar magnetron sputtering method. The areal capacitance of the SiNWs-CrN, as measured in 0.

The Use of a Water Soluble Flexible Substrate to Embed Electronics in Additively Manufactured Objects: From Tattoo to Water Transfer Printed Electronics.

The integration of electronics into the process flow of the additive manufacturing of 3D objects is demonstrated using water soluble films as a temporary flexible substrate. Three process variants are detailed to evaluate their capabilities to meet the additive manufacturing requirements. One of them, called water transfer printing, shows the best ability to fabricate electronics onto 3D additively manufactured objects.

Conformal Electronics Wrapped Around Daily Life Objects Using an Original Method: Water Transfer Printing.

The water transfer printing method is used to transfer patterned films on random three-dimensional objects. This industrially viable technology has been demonstrated to intimately wrap metallic and polymeric films around different materials. This method avoids the use of rigid substrate during the transfer step.

Epoxy Based Ink as Versatile Material for Inkjet-Printed Devices.

Drop on Demand inkjet printing is an attractive method for device fabrication. However, the reliability of the key printing steps is still challenging. This explains why versatile functional inks are needed.

Split and flow: reconfigurable capillary connection for digital microfluidic devices.

Supplying liquid to droplet-based microfluidic microsystems remains a delicate task facing the problems of coupling continuous to digital or macro- to microfluidic systems. Here, we take advantage of superhydrophobic microgrids to address this problem. Insertion of a capillary tube inside a microgrid aperture leads to a simple and reconfigurable droplet generation setup.

Zipping effect on omniphobic surfaces for controlled deposition of minute amounts of fluid or colloids.

When a drop sits on a highly liquid-repellent surface (super-hydrophobic or super-omniphobic) made of periodic micrometer-sized posts, its contact-line can recede with very weak mechanical retention providing that the liquid stays on top of the microsized posts. Occurring in both sliding and evaporation processes, the achievement of low-contact-angle hysteresis (low retention) is required for discrete microfluidic applications involving liquid motion or self-cleaning; however, careful examination shows that during receding, a minute amount of liquid is left on top of the posts lying at the receding edge of the drop. For the first time, the heterogeneities of these deposits along the drop-receding contact-line are underlined.

Engineering sticky superomniphobic surfaces on transparent and flexible PDMS substrate.

Following the achievement of superhydrophobicity which prevents water adhesion on a surface, superomniphobicity extends this high repellency property to a wide range of liquids, including oils, solvents, and other low surface energy liquids. Recent theoretical approaches have yield to specific microstructures design criterion to achieve such surfaces, leading to superomniphobic structured silicon substrate. To transfer this technology on a flexible substrate, we use a polydimethylsiloxane (PDMS) molding process followed by surface chemical modification.