On the Resolution Limit of Electrohydrodynamic Redox 3D Printing.

Additive manufacturing (AM) will empower the next breakthroughs in nanotechnology by combining unmatched geometrical freedom with nanometric resolution. Despite recent advances, no micro-AM technique has been able to synthesize functional nanostructures with excellent metal quality and sub-100 nm resolution. Here, significant breakthroughs in electrohydrodynamic redox 3D printing (EHD-RP) are reported by directly fabricating high-purity Cu (>98 at.

Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects.

As the microelectronics field pushes to increase device density through downscaling component dimensions, various novel micro- and nano-scale additive manufacturing technologies have emerged to expand the small scale design space. These techniques offer unprecedented freedom in designing 3D circuitry but have not yet delivered device-grade materials. To highlight the complex role of processing on the quality and microstructure of AM metals, we report the electrical properties of micrometer-scale copper interconnects fabricated by Fluid Force Microscopy (FluidFM) and Electrohydrodynamic-Redox Printing (EHD-RP).

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing.

The control of materials' microstructure is both a necessity and an opportunity for micro/nanometer-scale additive manufacturing technologies. On the one hand, optimization of purity and defect density of printed metals is a prerequisite for their application in microfabrication. On the other hand, the additive approach to materials deposition with highest spatial resolution offers unique opportunities for the fabrication of materials with complex, 3D graded composition or microstructure.

Thermal Management in Ni/Al Reactive Multilayers: Understanding and Preventing Reaction Quenching on Thin Film Heat Sinks.

Thermal management is conventionally the design of microelectronics circuitry to maximize heat extraction and minimize local heating. In this work, we investigate a reverse thermal management problem related to understanding and preventing heat dissipation during the propagation of a self-sustained reaction in Ni/Al reactive multilayers, metastable nanostructures that can release heat through a self-sustained propagating exothermic reaction. While it was recently demonstrated that reactive multilayers can serve as on-chip heat sources for on-demand healing of metal films, they still face challenges of device integration due to conductive heat losses to the substrate or adjacent on-chip components, which act as heat sinks and consequently quench the reaction.