A flexible supercapacitor (SC) is an attractive energy storage device for powering low-power sensors, since it can be built using only nontoxic and sustainable materials. In this study, the advantages of using biodegradable polylactic acid (PLA) substrate for printed SC are investigated by studying the SC's cyclic bending reliability, failure mechanism, and the impact of the bending radius. The results confirm that the SCs with laminated PLA with polymer barrier substrate exhibited the highest bending reliability, stability, and capability in preventing liquid electrolyte evaporation among the investigated substrates.
View Article and Find Full Text PDFBackground And Aims: The aim of this study was to examine an association of individual and combined pulse waveform parameters derived from bioimpedance measurements, that is pulse waves from a distal impedance plethysmographic (IPG), a whole-body impedance cardiographic (ICG) and transformed distal impedance plethysmographic (tIPG) signals, with markers of subclinical atherosclerosis, i.e. carotid intima-media thickness (cIMT), brachial artery flow-mediated dilation (FMD) and carotid artery distensibility (Cdist).
View Article and Find Full Text PDFStretchable electronics promise to extend the application range of conventional electronics by enabling them to keep their electrical functionalities under system deformation. Within this framework, development of printable silver-polymer composite inks is making possible to realize several of the expected applications for stretchable electronics, which range from seamless sensors for human body measurement (e.g.
View Article and Find Full Text PDFIn recent years, additive manufacturing of polydimethylsiloxane (PDMS) has gained interest for the development of soft electronics. To build complex electrical devices, fabrication of multilayered structures is required. We propose here a straightforward digital printing fabrication process of silicone rubber-based, multilayered electronics.
View Article and Find Full Text PDFScalable fabrication of high-rate micro-supercapacitors (MSCs) is highly desired for on-chip integration of energy storage components. By virtue of the special self-assembly behavior of 2D materials during drying thin films of their liquid dispersion, a new inkjet printing technique of passivated graphene micro-flakes is developed to directly print MSCs with 3D networked porous microstructure. The presence of macroscale through-thickness pores provides fast ion transport pathways and improves the rate capability of the devices even with solid-state electrolytes.
View Article and Find Full Text PDFAnnu Int Conf IEEE Eng Med Biol Soc
July 2019
Heart rate and heart rate variability parameters provide important information on sympathetic and parasympathetic branches of autonomous nervous system. These parameters are usually extracted from electrocardiograms often measured between two electrodes and called an ECG lead. Besides systems intended only for heart rate measurement, ECG measurement devices employ several well-known lead systems including the standard 12-lead system, EASI lead system and Mason-Likar systems.
View Article and Find Full Text PDFMedical treatment is increasingly benefiting from biomedical microsystems, especially the trending telemedical application. A promising modality for tumor therapy showed the application of nanosecond pulsed electric fields (nsPEF) on cells to achieve nanoporation, cell death, and other cell reactions. A key technology for this method is the generation of pulsed fields in the nanosecond range with high-field strengths in the range of several kilovolts per centimeter.
View Article and Find Full Text PDFAdvances in flexible and stretchable electronics, functional nanomaterials, and micro/nano manufacturing have been made in recent years. These advances have accelerated the development of wearable sensors. Wearable sensors, with excellent flexibility, stretchability, durability, and sensitivity, have attractive application prospects in the next generation of personal devices for chronic disease care.
View Article and Find Full Text PDFMicromachines (Basel)
December 2018
The stretchability of electronic devices is typically obtained by tailoring the stretchable interconnects that link the functional units together. The durability of the interconnects against environmental conditions, such as deformation and chemicals, is therefore important to take into account. Different approaches, including encapsulation, are commonly used to improve the endurance of stretchable interconnects.
View Article and Find Full Text PDFInterposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections.
View Article and Find Full Text PDFEpidermal electronic systems (EESs) are skin-like electronic systems, which can be used to measure several physiological parameters from the skin. This paper presents materials and a simple, straightforward fabrication process for skin-conformable inkjet-printed temperature sensors. Epidermal temperature sensors are already presented in some studies, but they are mainly fabricated using traditional photolithography processes.
View Article and Find Full Text PDFThis article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-μm thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.
View Article and Find Full Text PDFIn this contribution we discuss the sintering of an inkjet-printed copper nanoparticle ink based on electrical performance and microstructure analysis. Laser and intense pulsed light (IPL) sintering are employed in order to compare the different techniques and their feasibility for electronics manufacturing. A conductivity of more than 20% of that of bulk copper material has been obtained with both sintering methods.
View Article and Find Full Text PDFAnnu Int Conf IEEE Eng Med Biol Soc
August 2013
This paper presents a hybrid wearable bio-sensing system, which combines traditional small-area low-power and high-performance System-on-Chip (SoC), flexible paper substrate and cost-effective Printed Electronics. Differential bio-signals are measured, digitized, stored and transmitted by the SoC. The total area of the chip is 1.
View Article and Find Full Text PDFIEEE Trans Inf Technol Biomed
November 2012
This paper presents the prototype implementation of a Bio-Patch using fully integrated low-power System-on-Chip (SoC) sensor and paper-based inkjet printing technology. The SoC sensor is featured with programmable gain and bandwidth to accommodate a variety of bio-signals. It is fabricated in a 0.
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