Pressure-Activated Thermal Transport via Oxide Shell Rupture in Liquid Metal Capsule Beds.

Liquid metal (LM)-based thermal interface materials (TIMs) have the potential to dissipate high heat loads in modern electronics and often consist of LM microcapsules embedded in a polymer matrix. The shells of these microcapsules consist of a thin LM oxide that forms spontaneously. Unfortunately, these oxide shells degrade heat transfer between LM capsules.

In Situ Alloying of Thermally Conductive Polymer Composites by Combining Liquid and Solid Metal Microadditives.

Room-temperature liquid metals (LMs) are attractive candidates for thermal interface materials (TIMs) because of their moderately high thermal conductivity and liquid nature, which allow them to conform well to mating surfaces with little thermal resistance. However, gallium-based LMs may be of concern due to the gallium-driven degradation of many metal microelectronic components. We present a three-component composite with LM, copper (Cu) microparticles, and a polymer matrix, as a cheaper, noncorrosive solution.