Thermal transport in amorphous silicon dioxide (a-SiO) is traditionally treated as random walks of vibrations owing to its greatly disordered structure, which results in a mean free path (MFP) approximately the same as the interatomic distance. However, this picture has been debated constantly and in view of the ubiquitous existence of thin a-SiO layers in nanoelectronic devices, it is imperative to better understand this issue for precise thermal management of electronic devices. Different from the commonly used cross-plane measurement approaches, here we report on a study that explores the in-plane thermal conductivity of double silicon nanoribbons with a layer of a-SiO sandwiched in-between.
View Article and Find Full Text PDFThe thermal conductivities of two groups of silicon nanoribbons of ∼20 and ∼30 nm thickness and various widths have been measured and analyzed through combining the Callaway model and the Fuchs-Sondheimer (FS) reduction function. The results show that while the data for the ∼30 nm thick ribbons can be well-explained by the classical size effect, the measured thermal conductivities for the ∼20 nm thick ribbons deviate from the prediction remarkably, and size effects beyond phonon-boundary scattering must be considered. The measurements of the Young's modulus of the thin nanoribbons yield significantly lower values than the corresponding bulk value, which could lead to a reduced phonon group velocity and subsequently thermal conductivity.
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