Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs.

The deposition of increased volumes of Cu down an interconnect through-hole via (THV) of a Printed Circuit Board (PCB) is highly desirable for the fabrication of increasing component density and PCB stacks. A quality metric, called micro-throwing power, characterises the volume of Cu that can be deposited within a THV. In this paper, we analyse the influence of 1 ± 0.

Copper electroplating of PCB interconnects using megasonic acoustic streaming.

In this research experimental and simulated analysis investigates the influence of megasonic (MS; 1 ± 0.05 MHz) acoustic-assisted electroplating techniques, with respect to the fabrication of through-hole via (THV) and blind-via (BV) interconnects for the Printed Circuit Board (PCB) industry. MS plating of copper down THV and BV interconnects was shown to produce measurable benefits such as increased connectivity throughout a PCB and cost savings.