On the Analyses of Cure Cycle Effects on Peel Strength Characteristics in Carbon High- Epoxy/Plasma-Activated Carbon PEEK Composite Interfaces: A Preliminary Inquiry.

In this study, a high- aerospace-grade epoxy composite plate was co-curing welded using a unidirectional PEEK thermoplastic carbon fibre tape to develop advanced composite joints. To account for the surface roughness and the weldability of carbon-epoxy/carbon-PEEK composites, plasma treatments were performed. The co-curing was conducted by the following steps: each treated thermoplastic tape was first placed in the mould, and followed by nine layers of dry-woven carbon fabrics.

On the Addition of Multifunctional Methacrylate Monomers to an Acrylic-Based Infusible Resin for the Weldability of Acrylic-Based Glass Fibre Composites.

The melt strength of Elium acrylic resin is an important factor to ensure limited fluid flow during welding. To provide Elium with a suitable melt strength via a slight crosslink, this study examines the effect of two dimethacrylates, namely butanediol-di-methacrylate (BDDMA) and tricyclo-decane-dimethanol-di-methacrylate (TCDDMDA), on the weldability of acrylic-based glass fibre composites. The resin system impregnating a five-layer woven glass preform is a mixture of Elium acrylic resin, an initiator, and each of the multifunctional methacrylate monomers in the range of 0 to 2 parts per hundred resin (phr).

On the Hot-Plate Welding of Reactively Compatibilized Acrylic-Based Composites/Polyamide (PA)-12.

Joining of dissimilar thermoplastics and their composites is a challenge for thermal welding techniques due to different melting points. Reactive welding with an auxiliary functional material can offer the clear opportunities to develop joining processes due to robustness to joining dissimilar thermoplastic polymers and their composites. The current study employed reactive compatibilization to offer the possibility of joining an acrylic-based glass fiber composite to polyamide (PA)-12 by applying a hot-tool welding technique.