In-situ TEM studies of the sintering behavior of copper nanoparticles covered by biopolymer nanoskin.

Sintering behavior of copper nanoparticles with a protective layer of gelatin synthesized by wet-chemical process with an average diameter of 45 nm has been observed using in-situ transmission electron microscopy (TEM). Copper nanoparticles were sublimated without sintering at about 925 degrees C at 2.0 x 10(-)(5) Pa, and carbonized gelatin remained and retained the shape of the initial layer of nanoparticles.

Size-controlled oxidation-resistant copper fine particles covered by biopolymer nanoskin.

Size-controlled oxidation-resistant copper fine particles were prepared from insoluble CuO micron-sized particles. The particle sizes were quite uniform and could be varied only by the concentration of the complex reagent from 45 to 175 nm. No template material was needed for size control.

The preparation of copper fine particle paste and its application as the inner electrode material of a multilayered ceramic capacitor.

Well size-controlled copper fine particles (diameter: 100-300 nm) were used as the inner electrode material of multilayered ceramic capacitors (MLCCs). The particles were dispersed in terpineol to form a printing paste with 50 wt% copper particles. The MLCC precursor modules prepared by the layer-by-layer printing of copper and BaTiO(3) particles were cosintered.