Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation.

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses prevail due to the injected viscous thermoplastic melt.

Influence of Injection Molding Parameters on the Peel Strength between Plasma-Treated Fluoropolymer Films and Polycarbonate.

Light guiding is used to direct light from an emitting source to a different location. It is frequently realized through a clad-core structure with a difference in the refractive index of the materials. This paper explores the possibility of combining a fluoropolymer (THV) film of low refractive index, serving as a cladding layer, with a polycarbonate (PC) core, via injection molding.

Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion.

The integration of structural electronics in injection-molded parts is a challenging step. The films-comprising of laminated stacks with electronics-are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts.

Combined Crack Initiation and Crack Growth Model for Multi-Layer Polymer Materials.

The current publication deals with the fracture toughness of polymeric multi-layer materials. In detail, the crack initiation and growth, crack arrest, and crack re-initiation of a multi-layer material are examined. The aim is to develop a numerical model for crack initiation and incremental crack growth of a three-layer single edge notched bending specimen that features one brittle layer in a plastically deforming matrix.