Enhancing High-Pressure Capillary Rheometer Viscosity Data Calculation with the Propagation of Uncertainties for Subsequent Cross-Williams, Landel, and Ferry (WLF) Parameter Fitting.

Measuring the shear viscosity of polymeric melts is an extensive effort frequently performed in high-pressure capillary rheometers, where the pressures required to push the melt through a capillary at various temperatures and volumetric flow rates are recorded. Then, the viscosity values are obtained through Bagley and Weissenberg-Rabinowitsch corrections involving parameter fitting. However, uncertainties in those conversions due to pressure variations and measurement inaccuracies (random errors) affect the accuracy of the consequently calculated viscosities.

Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation.

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses prevail due to the injected viscous thermoplastic melt.

Influence of Injection Molding Parameters on the Peel Strength between Plasma-Treated Fluoropolymer Films and Polycarbonate.

Light guiding is used to direct light from an emitting source to a different location. It is frequently realized through a clad-core structure with a difference in the refractive index of the materials. This paper explores the possibility of combining a fluoropolymer (THV) film of low refractive index, serving as a cladding layer, with a polycarbonate (PC) core, via injection molding.

Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion.

The integration of structural electronics in injection-molded parts is a challenging step. The films-comprising of laminated stacks with electronics-are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts.

A Study on Over-Molded Copper-Based Flexible Electronic Circuits.

Over-molding has been proposed in recent years as an integrated functional flexible circuit board in a plastic part. This method uses the conventional process for film insert technology. Over-molding has attracted significant attention across many industries due to its potential to deliver different electrical functions in a variety of different part geometries, especially in automotive interiors and home appliances.