Carbon nanotube embedded adhesives for real-time monitoring of adhesion failure in high performance adhesively bonded joints.

Carbon nanotubes (CNTs) embedded polymers are of increasing interest to scientific and industrial communities for multi-functional applications. In this article, CNTs have been introduced to high-strength epoxy adhesive for enabling in-situ strain sensing in adhesively bonded aluminium-to-aluminium single-lap joints to accurately indicate the onset and propagation of adhesion failure to the evolution of piezo-resistivity in varying mechanical loads. The CNT modified adhesive in bonded joints and the CNT modified adhesive alone have been tested under monothonic and cyclic tensile loads up to ultimate failure.

Carbon nanotube functionalization as a route to enhancing the electrical and mechanical properties of Cu-CNT composites.

Copper-CNT (carbon nanotube) composite materials are promising alternatives to conventional conductors in applications ranging from interconnects in microelectronics to electrical cabling in aircraft and vehicles. Unfortunately, exploiting the full potential of these composites is difficult due to the poor Cu-CNT electro-mechanical interface. We demonstrate through large-scale ab initio calculations and sonication experiments that this problem can be addressed by CNT surface modification.

Breaking the electrical barrier between copper and carbon nanotubes.

Improving the interface between copper and carbon nanotubes (CNTs) offers a straightforward strategy for the effective manufacturing and utilisation of Cu-CNT composite material that could be used in various industries including microelectronics, aerospace and transportation. Motivated by a combination of structural and electrical measurements on Cu-M-CNT bimetal systems (M = Ni, Cr) we show, using first principles calculations, that the conductance of this composite can exceed that of a pure Cu-CNT system and that the current density can even reach 10 A cm. The results show that the proper choice of alloying element (M) and type of contact facilitate the fabrication of ultra-conductive Cu-M-CNT systems by creating a favourable interface geometry, increasing the interface electronic density of states and reducing the contact resistance.

Soldering of Carbon Materials Using Transition Metal Rich Alloys.

Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures.