A novel AgCuTi brazing foil with a unique microstructure was developed, which could achieve strong vacuum brazing of Ti6Al4V (TC4) and sapphire. The brazing foil was composed of Ag solid solution (Ag(s,s)), Cu solid solution (Cu(s,s)), and layered Ti-rich phases, and had a low liquidus temperature of 790 °C and a narrow melting range of 16 °C, facilitating the defect-free joining of TC4 and sapphire. The sapphire/TC4 joint fabricated by using this novel AgCuTi brazing foil exhibited an outstanding average shear strength of up to 132.
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October 2023
Ruthenium (Ru) is a refractory metal that has applications in the semiconductor industry as a sputtering target material. However, conventional powder metallurgy methods cannot produce dense and fine-grained Ru targets with preferred orientation. Here, we present a novel method of hot-pressing deformation to fabricate Ru targets with high relative density (98.
View Article and Find Full Text PDFLuAG:Ce (LuAlO:Ce) is one of the most important color converters in white lighting industry. Especially, LuAG:Ce film attracts more attention due to the outstanding advantages, such as the efficient heat dissipation, the saving of rare earth, and so on. Here, LuAG:Ce film on sapphire was successfully prepared by the ultrasonic spray pyrolysis process.
View Article and Find Full Text PDFAg/YO has excellent potential to replace Ag/CdO as the environmentally friendly electrical contact material. Using spherical YO as the starting material, Ag/YO contacts with a quasi-continuous network structure were successfully fabricated by a low-energy ball milling treatment. The mean size of YO used ranged from 243 to 980 nm.
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