Publications by authors named "Manjunath Vatnalmath"

The present study aims at producing transient liquid phase (TLP) bonded Al2219 joints with pure Cu (copper) as an interlayer. The TLP bonding is carried out at the bonding temperatures in the range of 480 to 520 °C while keeping the bonding pressure (2 MPa) and time (30 min.) constant.

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An Al2014-alumina (AlO) composite's characteristics are significantly influenced by the reinforcement particle size variation. Therefore, this study examines the microstructure, mechanical, fractography, and wear performance of an Al2014-AlO composite made using a unique two-stage stir casting method and various alumina weight fractions (9, 12, and 15 wt %). Three categories of alumina particle size are used, i.

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