Improved thermal conductivity of polyurethane (PU)-/SiC composite fabricated via solution casting method and its mechanical model for prediction and comparison.

Polymer composites having high thermal conductivity (TC) gained great interest, including the advancement of electronic devices to become more functionalized, scaled, and integrated. In view of these, herein, highly thermal conductive polyurethane (PU)-/SiC composites are fabricated via the solution casting method. Silicon carbide is used as the filler in both flexible and rigid-polyurethane matrices to enhance the value of TC for electronic applications.