Publications by authors named "Mahsa Kaltwasser"
This communication presents fluidic self-assembly of Si-chip on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melting points. The multilayer solder bump is a lead free ternary solder system, which provides a route to transform the melting point of interconnects for applications in solder directed fluidic self-assembly. The outermost metal layers form a low melting point BiIn solder shell (72 °C).
View Article and Find Full Text PDFArticle Synopsis
- The research presents a method for creating core-shell solder bumps that facilitate low-temperature chip assembly while allowing for high-temperature connections through transformation.
- The solder bumps consist of a BiIn-based shell with a lower melting point and a Sn core with a higher melting point, enabling assembly at temperatures between 60-80 °C.
- The process takes advantage of the liquid shell's properties to self-align silicon chips in a water bath and, after assembly, a brief heating phase transforms the solder into a solid connection with a higher melting point, achieving durable electrical bonds.