Thiol Carbazole Self-Assembled Monolayers as Tunable Carrier Injecting Interlayers for Organic Transistors and Complementary Circuits.

The significant contact resistance at the metal-semiconductor interface is a well-documented issue for organic thin-film transistors (OTFTs) that hinders device and circuit performance. Here, this issue is tackled by developing three new thiol carbazole-based self-assembled monolayer (SAM) molecules, namely tBu-2SCz, 2SCz, and Br-2SCz, and utilizing them as carrier-selective injection interlayers. The SAMs alter the work function of gold electrodes by more than 1 eV, making them suitable for use in hole and electron-transporting OTFTs.

Interfacial Engineering of MoS via Boron-Doping for Electrochemical N-to-NH Conversion.

The electrocatalytic synthesis of ammonia (NH) through the nitrogen reduction reaction (NRR) under ambient temperature and pressure is emerging as an alternative approach to the conventional Haber-Bosch process. However, it remains a significant challenge due to poor kinetics, low nitrogen (N) solubility in aqueous electrolytes, and the competing hydrogen evolution reaction (HER), which can significantly impact NH production rates and Faradaic efficiency (FE). Herein, a rationally designed boron-doped molybdenum sulfide (B-Mo-MoS) electrocatalyst is reported that effectively enhances N reduction to  NH with an onset potential of -0.

Ultraflat Cu(111) foils by surface acoustic wave-assisted annealing.

Ultraflat metal foils are essential for semiconductor nanoelectronics applications and nanomaterial epitaxial growth. Numerous efforts have been devoted to metal surface engineering studies in the past decades. However, various challenges persist, including size limitations, polishing non-uniformities, and undesired contaminants.