Analytic procedure for the evaluation of copper intermetallic diffusion in electroplated gold coatings with energy dispersive X-ray microanalysis.

A method for the determination of the intermetallic diffusion coefficient in the Cu-Au system is described based on energy dispersive X-ray techniques. XRF and EDS analysis were used to measure the thickness of the electroplated gold coating and the copper diffused through it, respectively. This information was used to obtain the diffusion coefficient through an equation based on Fick's law.