Morphology Control and Mechanism of Different Bath Systems in Cu/SiCw Composite Electroplating.

With the rapid development of electronic technology and large-scale integrated circuit devices, it is very important to develop thermal management materials with high thermal conductivity. Silicon carbide whisker-reinforced copper matrix (Cu/SiCw) composites are considered to be one of the best candidates for future electronic device radiators. However, at present, most of these materials are produced by high-temperature and high-pressure processes, which are expensive and prone to interfacial reactions.

Application of Ni/SiCw Composite Material in MEMS Microspring.

The microspring is a typical type of device in MEMS devices, with a wide range of application scenarios and demands, among which a popular one is the microelectroformed nickel-based planar microspring prepared by the UV-LIGA technology based on the SU-8 adhesive. It is worth noting that the yield strength of the electrodeposited nickel microstructure is low, and the toughness of the structure is not high, which is unbeneficial for the enduring and stable operation of the spring. The paper mainly presents the methods of preparing high-aspect-ratio Ni/SiCw microstructures for MEMS devices based on UV-LIGA technology, developing Ni/SiCw-based microspring samples with a thickness of 300 μm, and applying a DMA tensile tester for mechanical property tests and characterization.

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends.

With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requirements of high-performance chips. High thermal conductivity (TC), low coefficient of thermal expansion (CTE), good mechanical properties, and a rich foundation in microfabrication techniques are the fundamental requirements for the next generation of electronic packaging materials.

Process improvement of high aspect ratio nano-gratings based on synchrotron x-ray.

To achieve better structural accuracy and aspect ratio, nano-gratings with a vertical angle close to 90° and a depth-to-width ratio of about 8 were prepared by synchrotron radiation. The optimal exposure dose and development time were determined to be 0.006 (A·h) and 6 min, respectively, by observing the surface loss and roughness of the gratings with slit widths of 150 nm and 250 nm under different conditions.

Design, Manufacture and Test of Piezoelectric Cantilever-Beam Energy Harvesters with Hollow Structures.

This article presents a single-crystal piezoelectric energy harvester (PEH) with a trapezoidal hollow hole that can obtain high energy density at low frequency. Harvesters with a hollow structure were fabricated through a series of manufacturing processes such as thermocompression bonding, screen printing and laser cutting. Finite element analysis (FEA) and experimental results showed that using low modulus brass instead of stainless steel as the PEH substrate enhances the voltage output of the device, and the hollow design greatly increases the overall stress level and power density.

Preparation of Microneedle Array Mold Based on MEMS Lithography Technology.

As a transdermal drug delivery technology, microneedle array (MNA) has the characteristics of painless, minimally invasive, and precise dosage. This work discusses and compares the new MNA mold prepared by our group using MEMS technology. First, we introduced the planar pattern-to-cross-section technology (PCT) method using LIGA (Photolithography, Galvanogormung, Abformung) technology to obtain a three-dimensional structure similar to an X-ray mask pattern.

Shock-Resistibility of MEMS-Based Inertial Microswitch under Reverse Directional Ultra-High g Acceleration for IoT Applications.

This paper presents a novel MEMS-based inertial microswitch design with multi-directional compact constraint structures for improving the shock-resistibility. Its shock-resistibility in the reverse-sensitive direction to ultra-high g acceleration (~hunderds of thousands) is simulated and analyzed. The dynamic response process indicates that in the designed inertial microswitch the proof mass weight G, the whole system's stiffness k and the gap x between the proof mass and reverse constraint blocks have significant effect on the shock-resistibility.