Signal drift and hysteresis of flexible piezoresistive sensors pose significant challenges against the widespread applications in emerging fields such as electronic skin, wearable equipment for metaverse and human-AI (artificial intelligence) interfaces. To address the creep and relaxation issues associated with pressure-sensitive materials, a highly stable piezoresistive composite is proposed, using polyamide-imide (PAI) fibers as the matrix and in situ grafted-polymerized polyaniline (PANI) as the semi-conducting layer. The PAI with large rigid fluorenylidene groups exhibits a high glass transition temperature of 372 °C (PAI 5-5), which results in an extremely long relaxation time at room temperature and consequently offers outstanding anti-creep/relaxation performances.
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