Molecular Dynamics Simulation of the CuSn/Cu Interfacial Diffusion Mechanism under Electrothermal Coupling.

With the increasing power density of electronic devices, solder joints are prone to electromigration under high currents, which results in a significant threat to reliability. In this study, the molecular dynamics method is used to study the diffusion mechanism of the CuSn/Cu interface under the action of electrothermal coupling. The results show that the diffusion activation energy decreases with an increase in electric field intensity, accelerating the diffusion of the CuSn/Cu interface.