Robust and Manufacturable Lithium Lanthanum Titanate-Based Solid-State Electrolyte Thin Films Deposited in Open Air.

State-of-the-art solid-state electrolytes (SSEs) are limited in their energy density and processability based on thick, brittle pellets, which are generally hot pressed in vacuum over the course of several hours. We report on a high-throughput, open-air process for printable thin-film ceramic SSEs in a remarkable one-minute time frame using a lithium lanthanum titanium oxide (LLTO)-based SSE that we refer to as robust LLTO (R-LLTO). Powder XRD analysis revealed that the main phase of R-LLTO is polycrystalline LLTO, accompanied by selectively retained crystalline precursor phases.

Finite Element Modeling of Quantitative Ultrasound Analysis of the Surgical Margin of Breast Tumor.

Ultrasound is commonly used as an imaging tool in the medical sector. Compared to standard ultrasound imaging, quantitative ultrasound analysis can provide more details about a material microstructure. In this study, quantitative ultrasound analysis was conducted through computational modeling to detect various breast duct pathologies in the surgical margin tissue.

Mechanical Anisotropy and Surface Roughness in Additively Manufactured Parts Fabricated by Stereolithography (SLA) Using Statistical Analysis.

In this study, the degree of mechanical anisotropy was investigated through tensile testing of specimens built in different orientations and designed according to the ASTM D638 standard. The mechanical properties that were evaluated include Young's modulus, ultimate tensile strength (UTS), and percentage elongation. Additionally, physical properties, such as mean surface roughness (Ra), density and dimension of the cross-sectional area, were also measured.

Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: a multi-scale modeling approach.

Carbon nanotube (CNT)/copper (Cu) composite material is proposed to replace Cu-based through-silicon vias (TSVs) in micro-electronic packages. The proposed material is believed to offer extraordinary mechanical and electrical properties and the presence of CNTs in Cu is believed to overcome issues associated with miniaturization of Cu interconnects, such as electromigration. This study introduces a multi-scale modeling of the proposed TSV in order to evaluate its mechanical integrity under mechanical and thermo-mechanical loading conditions.