[The influence of physical-chemical characteristics of surface modified copper nanoparticles on E. coli cell population growth suppression and on electrostatic properties of their membranes].

The biological activity of copper nanoparticles, able to suppress growth of E. coli cells population under contact interactions, was explored. Three types of samples with oxide layers of various sizes, thickness and composition were used in experiments.

[Copper-induced change in the ESR signal of hemoglobin nitrosyl complexes in wound by the action of copper nanoparticles].

The results concerning changes in the ESR signal of hemoglobin nitrosyl complexes in wound tissues in the course of healing by the action of ointments with copper nanoparticles (patent N2460532, Russia) are presented. It is shown that the wound healing process modified by the influence of copper nanoparticles demonstrates the increase in the ESR signal amplitude for :hemoglobin nitrosyl complexes as compared with controls (the ointment base without nanoparticles). Planimetric measurements of wound area through reparation course indicate an active process of wound healing for injuries treated with copper nanoparticles in the ointment, resulting in lessening half-reparation time up to 5.

[Antimicrobial activity of bacteriocin S760 produced by Enterococcus faecium strain LWP760].

Antimicrobial activity of bacteriocin S760 (enterocin) produced by Enterococcusfaecium strain LWP760 was studied. Bacteriocin S760 is a cationic, hydrophobic, and heat stable peptide with the molecular weight of 5.5 kDa and pl of 9.

[Mechanism of the toxic action of copper nanoparticles on Escherichia coli bacteria].

Some features of contact interaction of Escherichia coli with Cu nanoparticles 75-100 nm in diameter have been studied. The analysis of variations in the amplitude of fluorescence of the negatively charged probe 1-anilinonaphthalene-8-sulfonate (ANS) in Gouy-Chapmen coordinates indicates an increase (in the absolute value) in the electrostatic potential of E. coli external membrane during the contact with Cu nanoparticles.