Strain-invariant stretchable radio-frequency electronics.

Wireless modules that provide telecommunications and power-harvesting capabilities enabled by radio-frequency (RF) electronics are vital components of skin-interfaced stretchable electronics. However, recent studies on stretchable RF components have demonstrated that substantial changes in electrical properties, such as a shift in the antenna resonance frequency, occur even under relatively low elastic strains. Such changes lead directly to greatly reduced wireless signal strength or power-transfer efficiency in stretchable systems, particularly in physically dynamic environments such as the surface of the skin.

Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding.

The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability of flexible devices. The heat transfer phenomena during the LAB process, mechanical deformation, and the flexibility of a flexible package were analyzed by experimental and numerical simulation methods. The flexible package was fabricated with a silicon chip and a polyimide (PI) substrate.

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining.

An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formulation and investigation of its reaction mechanism with solder powder is challenging. In this study, we demonstrate a newly designed ESP consisting of diglycidyl ether of bisphenol F (DGEBF) resin, Sn-3.

Large-Scale Rapid Laser Sintering of Highly Stretchable Electrodes Using a Homogenized Rectangular Laser Beam.

This study explored the feasibility of a fast and uniform large-scale laser sintering method for sintering stretchable electrodes. A homogenized rectangular infrared (IR) laser with a wavelength of 980 nm was used in the sintering process. A highly stretchable composite electrode was fabricated using silver (Ag) microparticles and Ag flakes as the fillers and polyester resin as the binder on the polyurethane substrate.

High-performance photoreceivers based on vertical-illumination type Ge-on-Si photodetectors operating up to 43 Gb/s at λ~1550nm.

We present high-sensitivity photoreceivers based on a vertical- illumination-type 100% Ge-on-Si p-i-n photodetectors (PDs), which operate up to 50 Gb/s with high responsivity. A butterfly-packaged photoreceiver using a Ge PD with 3-dB bandwidth (f(-3dB)) of 29 GHz demonstrates the sensitivities of -10.15 dBm for 40 Gb/s data rate and -9.

Channel estimation and synchronization for polarization-division multiplexed CO-OFDM using subcarrier/polarization interleaved training symbols.

We propose and demonstrate the use of subcarrier/polarization-interleaved training symbols for channel estimation and synchronization in polarization-division multiplexed (PDM) coherent optical orthogonal frequency-division multiplexed (CO-OFDM) transmission. The principle, the computational efficiency, and the frequency-offset tolerance of the proposed method are described. We show that the use of subcarrier/polarization interleaving doubles the tolerance to the frequency offset between the transmit laser and the receiver's optical local oscillator as compared to conventional schemes.