Microwave Sintering of Silver Nanoink for Radio Frequency Applications.

Microwave sintering is a promising method for low-temperature processes, as it provides advantages such as uniform, fast, and volumetric heating. In this study, we investigated the electrical characteristics of inkjet-printed silver (Ag) circuits sintered by microwaves. The microstructural evolutions of inkjet-printed Ag circuits sintered at various temperatures for different durations were observed with a field emission scanning electron microscope.

Screen-printed Cu circuit for low-Cost fabrication and its electrochemical migration characteristics.

Circuit pitch has decreased due to the demand for high-performance and multi-functional electronic devices. This trend has increased the risk of short-circuit failures by electrochemical migration (ECM), which is the transportation of ions between the cathode and anode under electrical potential. While direct printing has emerged as a promising technology in terms of manufacturing cost and environmental issues, there are few studies about ECM in directly printed copper (Cu) nanopaste.

Effect of atmospheric-pressure plasma treatment on the adhesion characteristics of screen-printed Ag nanoparticles on polyimide.

We investigated the adhesion characteristics of screen-printed silver (Ag) tracks on polyimide (PI) treated by atmospheric-pressure plasma (APP). Oxygen plasma was applied to the PI surface, and the APP-treated surface was exposed to air for various periods of time in order to evaluate the sustainability of the APP treatment. The adhesion of the Ag/PI interface was measured using a roll-type 90 degrees peel test.

Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns.

Since direct printing technology has developed intensively, low-cost fabrication and reliability have become critical challenges for mass production of printed electronic devices. The silver/copper (Ag/Cu) nanopaste was manufactured by Ag nanopaste mixed with different proportions of Cu nanoparticles ranging from 0 to 5 vol.% in order to investigate the influences of Cu content on the electrical properties and electrochemical migration (ECM) characteristics.

Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance.

Direct printing such as inkjet, gravure, and screen printing is an attractive approach for achieving low-cost circuitry in the printed circuit board industry. One of the challenges for direct printing technology, however, is the poor resistance to electrochemical migration (ECM), especially for silver (Ag) which has been widely used in printed electronics. We demonstrate improved resistance to Ag electrochemical migration by adding palladium (Pd) nanoparticles to the Ag nanopaste.