Dotette: Programmable, high-precision, plug-and-play droplet pipetting.

Manual micropipettes are the most heavily used liquid handling devices in biological and chemical laboratories; however, they suffer from low precision for volumes under 1 l and inevitable human errors. For a manual device, the human errors introduced pose potential risks of failed experiments, inaccurate results, and financial costs. Meanwhile, low precision under 1 l can cause severe quantification errors and high heterogeneity of outcomes, becoming a bottleneck of reaction miniaturization for quantitative research in biochemical labs.

Multi-dimensional studies of synthetic genetic promoters enabled by microfluidic impact printing.

Natural genetic promoters are regulated by multiple cis and trans regulatory factors. For quantitative studies of these promoters, the concentration of only a single factor is typically varied to obtain the dose response or transfer function of the promoters with respect to the factor. Such design of experiments has limited our ability to understand quantitative, combinatorial interactions between multiple regulatory factors at promoters.

Comparison of piezoresistive sensor to PicoPress® in in-vitro interface pressure measurement.

Objective Interface pressure, the sine qua non for compression therapy, is rarely measured in clinical practice and scientific research. The goal of this study aimed to compare and examine the accuracy between a commercially available piezoresistive sensor and PicoPress® (Microlab, Padua, Italy) using the cylinder cuff model to measure in-vitro interface pressure. Method Ten piezoresistive sensors were calibrated using the National Institute of Standard and Technology certified manometer, and compared to PicoPress® using cylinder cuff model from 20 to 120 mmHg.

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging.

Three-dimensional (3D) structure with through silicon via (TSV) technology is emerging as a key issue in microelectronic packaging industry, and electrical reliability has become one of the main technical subjects for the TSV designs. However, criteria used for TSV reliability tests have not been consistent in the literature, so that the criterion itself becomes a technical argument. To this end, this paper first performed several different reliability tests on the testing packaging with TSV chains, then statistically analyzed the experimental data with different failure criteria on resistance increasing, and finally constructed the Weibull failure curves with parameter extractions.