Publications by authors named "Kristof Croes"
Article Synopsis
- As electronic devices get smaller and more complex, the effects of electromigration (EM) in interconnects become more significant, impacting their reliability and lifespan.
- This paper presents a simulation framework to study EM in nano-interconnects, focusing on how metal microstructure affects atomic flux and stress distribution due to diffusion variations.
- The study offers a novel method for creating realistic microstructures based on grain size data, advancing electromigration simulation by evaluating stress changes, void formation, and the effects of trench dimensions on copper interconnects, revealing optimal aspect ratios for extending EM lifetime.
Atomic layer deposition of ruthenium is studied as a barrierless metallization solution for future sub-10 nm interconnect technology nodes. We demonstrate the void-free filling in sub-10 nm wide single damascene lines using an ALD process in combination with 2.5 Å of ALD TiN interface and postdeposition annealing.
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