Study on the SPCC and CFRTP Hybrid Joint Performance Produced with Additional Nylon-6 Interlayer by Ultrasonic Plastic Welding.

Due to the high degree of dissimilarity in physicochemical properties between metal and carbon fiber, it presents a tremendous challenge to join them directly. In this paper, cold rolled steel (SPCC) and carbon fiber reinforced thermoplastic (CFRTP) chopped sheet hybrid joints were produced with the addition of Nylon 6 (PA6) thermoplastic film as an intermediate layer by the ultrasonic plastic welding method. The effect of ultrasonic welding energy and preheating temperature on the hybrid joint microstructure and mechanical behavior was well investigated.

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections.

Cu-Ag composite pastes consisting of carboxylate-capped Ag nanoparticles, spray-pyrolyzed Ag submicron particles, and copper formate were developed in this study for low-temperature low-pressure bonding. The joints between the Cu, Ni/Au, and Ag finished substrates can be well formed at temperatures as low as 160 °C under a load pressure of 1.6 MPa.

Plasma-Modified PI Substrate for Highly Reliable Laser-Sintered Copper Films Using CuO Nanoparticles.

Plasma modification of polyimide (PI) substrates upon which electrical circuits are fabricated by the laser sintering of cuprous oxide nanoparticle pastes was investigated systematically in this study. Surface properties of the PI substrate were investigated by carrying out atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS), and contact angle measurements. Experimental results show that surface characteristics of PI substrates, including surface energy, surface roughness, and surface binding significantly affected the mechanical reliability of the sintered copper structure.

Optimization of Piezoresistive Strain Sensors Based on Gold Nanoparticle Deposits on PDMS Substrates for Highly Sensitive Human Pulse Sensing.

In this study, highly-sensitive piezoresistive strain sensors based on gold nanoparticle thin films deposited on a stretchable PDMS substrate by centrifugation were developed to measure arterial pulse waveform. By controlling carbon chain length of surfactants, pH value and particle density of the colloidal solutions, the gauge factors of nanoparticle thin film sensors can be optimized up to 677 in tensile mode and 338 in compressive mode, and the pressure sensitivity up to 350. Low pH and thin nanoparticle films produce positive influences to superior gauge factors.

Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments.

This study employed finite element analysis to simulate ultrasonic metal bump direct bonding. The stress distribution on bonding interfaces in metal bump arrays made of Al, Cu, and Ni/Pd/Au was simulated by adjusting geometrical parameters of the bumps, including the shape, size, and height; the bonding was performed with ultrasonic vibration with a frequency of 35 kHz under a force of 200 N, temperature of 200 °C, and duration of 5 s. The simulation results revealed that the maximum stress of square bumps was greater than that of round bumps.

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints.

This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn-Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate material combinations. Nanoindentation was applied to investigate the mechanical properties of IMCs, including hardness, Young's modulus, work hardening exponent, yield strength, and plastic ability.