This paper presents a novel co-packaging approach through on-chip hybrid laser integration with photonic circuits using photonic wire bonding. The process involves die-bonding a low-cost semiconductor distributed-feedback (DFB) laser into a deep trench on a silicon-on-insulator (SOI) chip and coupling it to the silicon circuitry through photonic wire bonding (PWB). After characterizing the power-current-voltage (LIV) and optical spectrum of the laser, a wavelength-current relationship utilizing its tunability through self-heating a swept-frequency laser (SFL) is developed.
View Article and Find Full Text PDFSilicon photonic (SiP) evanescent-field biosensors aim to combine the information-rich readouts offered by lab-scale diagnostics, at a significantly lower cost, and with the portability and rapid time to result offered by paper-based assays. While SiP biosensors fabricated with conventional strip waveguides can offer good sensitivity for label-free detection in some applications, there is still opportunity for improvement. Efforts have been made to design higher-sensitivity SiP sensors with alternative waveguide geometries, including sub-wavelength gratings (SWGs).
View Article and Find Full Text PDFAnnu Int Conf IEEE Eng Med Biol Soc
November 2021
Cardiovascular diseases(CVDs) are the world's leading cause of death. Endothelial Dysfunction is an early stage of cardiovascular diseases and can effectively be used to detect the presence of the CVDs, monitor its progress and investigate the effectiveness of the treatment given. This study proposes a reliable approach for the screening of endothelial dysfunction via machine learning, using features extracted from a combination of Plethysmography, Digital Thermal Monitoring, biological features (age and gender) and anthropometry (BMI and pulse pressure).
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