Durability of enamel bonding using one-step self-etch systems on ground and unground enamel.

Objective: To examine the morphological, early and long-term microtensile bond strengths (microTBS) of one-step self-etch systems to unground and ground enamel.

Materials And Methods: Resin composite (Filtek Z250) buildups were bonded to the buccal and lingual enamel surfaces (unground, bur-cut or SiC-roughened enamel) of third molars after adhesive application using the following adhesives: Clearfil S3 Bond (CS3); Adper Prompt L-Pop (ADP); iBond (iB) and, as the control, Clearfil SE Bond (CSE). Six tooth halves were assigned for each condition.