Volume Shrinkage-Induced Voiding Mechanism During Electromigration of Cu/Ni/Sn-Ag Microbump.

The effects of annealing, electromigration, and thermomigration on volume shrinkage and voiding mechanisms of Cu/Ni/Sn-2.5Ag microbumps are systematically investigated by using scanning electron microscopy under current stressing of 1.5×10 A/cm² at 150 °C.

Effects of Environmental Conditions on Interfacial Adhesion Between Screen-Printed Ag Film and Polyimide Substrate.

The effects of environmental conditions on the interfacial adhesion between screen-printed Ag film and polyimide substrate interface are quantitatively evaluated using the 90° peel test. The adhesion of printed patterns is varied by annealing time and atmosphere conditions. The peel strengths of air, high vacuum, and N₂ atmosphere samples increase after post-annealing for 24 h, which are closely related to the curing effect of binder in Ag paste.