Kinetic Monte Carlo simulation of polycrystalline silver metal electrodeposition: scaling of roughness and effects of deposition parameters.

In this work, a kinetic Monte Carlo (KMC) technique was used to simulate the growth morphology of electrodeposited polycrystalline Ag thin films under a galvanostatic condition (current density). The many-body Embedded Atom Method (EAM) potential has been used to describe the Ag-Ag atomic interaction. Herein, the surface morphology is affected by the kinetic diffusion of adatoms where four jump processes are considered, namely hopping, exchange, step-edge exchange and grain boundary.