Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties.

Nanocomposites consisting of Cu or Cu2O nanoparticles in various polyimide (PI) films were successfully prepared using polyamic acid (PAA) and Cu powders. Cu powders were dissolved into PAA solutions, and the solutions were spin-coated onto the substrates. Cu or Cu2O nanoparticles were formed in PI film by curing in a reducing or inert atmosphere, respectively.

Fabrication of copper nanoparticles in a thick polyimide film cured by rapid thermal annealing.

We investigated the imidization of a polyimide (PI) and the formation of Cu nanoparticles in a PI film by curinga precursor of PI (polyamic acid (PAA) dissolved in n-methyl-2-pyrrolidinone) in a reducing atmosphere in the rapid thermal annealing (RTA) system. A Cu film was deposited onto the SiO2/Si substrate, and the PAA was spin-coated onto the Cu film. After the PAA reacted with the Cu film, soft-baking was performed to evaporate the solvent.

Formation of Cu or Cu2O nanoparticles embedded in a polyimide film for nanofloating gate memory.

Cu and Cu2O nanoparticles were fabricated in polyimide by curing the stacked polyamic acid/Cu/polyamic acid on Si wafer and post heat treatment. Nanoparticle distribution in polyimide (a monolayer of vertically aligned nanoparticles or the randomly dispersed nanoparticles) can be controlled by changing the reactivity of Cu with PAA and curing atmosphere. About 6-7 nm sized Cu or Cu2O nanoparticles were observed in the polyimide film.