Experimental and Theoretical Investigation on Heat Transfer Enhancement in Micro Scale Using Helical Connectors.

Microscale electronics have become increasingly more powerful, requiring more efficient cooling systems to manage the higher thermal loads. To meet this need, current research has been focused on overcoming the inefficiencies present in typical thermal management systems due to low Reynolds numbers within microchannels and poor physical properties of the working fluids. For the first time, this research investigated the effects of a connector with helical geometry on the heat transfer coefficient at low Reynolds numbers.