Enhancing Gluten-Free Crispy Waffles with Soybean Residue (Okara) Flour: Rheological, Nutritional, and Sensory Impacts.

The incorporation of okara, a by-product of soybean milk production, into gluten-free products such as crispy waffles poses challenges due to the absence of gluten's viscoelastic properties and the high fiber content of okara. This study aimed to evaluate the effects of okara flour on the rheological properties, physical attributes, and sensory qualities of gluten-free waffles. Waffle batters with varying levels of okara flour (10%, 20%, 30%, and 40%) were prepared, and their rheological properties were analyzed using oscillatory shear and creep-recovery tests.

Effect of the Addition of Soybean Residue (Okara) on the Physicochemical, Tribological, Instrumental, and Sensory Texture Properties of Extruded Snacks.

An extrusion process was used to improve the physical and textural characteristics of an extruded snack supplemented with soybean residue (okara). An extreme vertices mixture design with a constraint for okara flour (0−50%), mung bean flour (20−70%), and rice flour (20−80%) resulted in the production of eleven formulations. The color, radial expansion index (REI), bulk density, tribological behavior, and instrumental and sensory texture of the extruded snacks were evaluated.