Zeolite-inspired low-k dielectrics overcoming limitations of zeolite films.

Spin-on zeolite films deposited from Silicalite-1 nanocrystal suspensions prepared by hydrothermal treatment of clear solutions have the required properties for insulating media in microelectronics. However, on the scale of the feature sizes in on-chip interconnects of a few tens of nanometers, their homogeneity is still insufficient. We discovered a way to overcome this problem by combining the advantages of the clear solution approach of Silicalite-1 synthesis with a sol-gel approach.

Reaction of trimethylchlorosilane in spin-on Silicalite-1 zeolite film.

We present a study on the hydrophobization of spin-on Silicalite-1 zeolite films through silylation with trimethylchlorosilane. Microporous and micro-mesoporous Silicalite-1 films were synthesized by spin coating of suspensions of Silicalite-1 nanozeolite crystallized for different times. Ellipsometric porosimetry with toluene and water adsorbates reveals that silylation decreases the porosity and makes the films hydrophobic.

Patterning of metallic nanoparticles for the growth of carbon nanotubes.

We report a straightforward method of patterning large ordered arrays of metallic nanoparticles using existing semiconductor processing technology. The topographies of contact holes created on full 200 mm wafers serve as templates to pattern Ni or Co nanoparticles. Over a large range of synthesis conditions, these patterned nanoparticles are demonstrated to successfully catalyse the growth of carbon nanotubes (CNTs) selectively in the patterned areas of the wafer.

Porous low dielectric constant materials for microelectronics.

Materials with a low dielectric constant are required as interlayer dielectrics for the on-chip interconnection of ultra-large-scale integration devices to provide high speed, low dynamic power dissipation and low cross-talk noise. The selection of chemical compounds with low polarizability and the introduction of porosity result in a reduced dielectric constant. Integration of such materials into microelectronic circuits, however, poses a number of challenges, as the materials must meet strict requirements in terms of properties and reliability.

Characterization of a molecular sieve coating using ellipsometric porosimetry.

Ellipsometric porosimetry was used to determine the adsorption isotherms of toluene, methanol, and water on b-oriented Silicalite-1 coatings with a thickness of less than ca. 250 nm and to obtain adsorption kinetics. The adsorption isotherms are of sufficient quality to reveal several aspects of the pore structure such as the adsorbate capacity and the adsorbate/framework affinity.

Nanoscale indentation of polymer and composite polymer-silica core-shell submicrometer particles by atomic force microscopy.

Atomic force microscopy was employed to probe the mechanical properties of surface-charged polymethylmethacrylate (PMMA)-based terpolymer and composite terpolymer core-silica shell particles in air and water media. The composite particles were achieved with two different approaches: using a silane coupling agent (composite A) or attractive electrostatic interactions (composite B) between the core and the shell. Young's moduli (E) of 4.