Novel automatic electrochemical-mechanical polishing (ECMP) of metals for scanning electron microscopy.

A low-stress automated polishing device was developed for preparing titanium and nickel alloys for scanning electron microscopy imaging. The system used pulsed electrochemical reactions within an alkaline electrolyte to generate a thin passivation layer on the surface of the sample, which was removed by the mechanical vibration of the system. The passivation layer development and removal were documented for Ti-6Al-4V and IN718 samples subjected to varying electrical potential cycles and polishing times.