Fiber array to chip attach using laser fusion splicing for low loss.

With the ever-increasing need for higher data rates, datacom and telecom industries are now migrating to silicon photonics to achieve higher data rates with reduced manufacturing costs. However, the optical packaging of integrated photonic devices with multiple I/O ports remains a slow and expensive process. We introduce an optical packaging technique to attach fiber arrays to a photonic chip in a single shot using CO laser fusion splicing.

Enhanced on-chip phase measurement by inverse weak value amplification.

Optical interferometry plays an essential role in precision metrology such as in gravitational wave detection, gyroscopes, and environmental sensing. Weak value amplification enables reaching the shot-noise-limit of sensitivity, which is difficult for most optical sensors, by amplifying the interferometric signal without amplifying certain technical noises. We implement a generalized form of weak value amplification on an integrated photonic platform with a multi-mode interferometer.