Improved Properties of the Atomic Layer Deposited Ru Electrode for Dynamic Random-Access Memory Capacitor Using Discrete Feeding Method.

Ruthenium (Ru) thin films deposited via atomic layer deposition (ALD) with a normal sequence and discrete feeding method (DFM) and their performance as a bottom electrode of dynamic random-access memory (DRAM) capacitors were compared. The DFM-ALD was performed by dividing the Ru feeding and purge steps of the conventional ALD process into four steps (shorter feeding time + purge time). The surface morphology of the Ru films was improved significantly with the DFM-ALD, and the preferred orientation of the Ru films was changed from relatively random to a <101>-oriented direction.