Pulse electrodeposition of Ni-W alloy for trench filling in microelectromechanical systems.

The effect of pulse current (PC) on Ni-W alloy electrodeposition was investigated to fill the trenches with aspect ratio 1:2 for MEMS applications. Rapid deposition of top side in trench produced a void in electrodeposits with direct current (DC). Morphology of Ni-W electrodeposition inside trench was strongly influenced by the applied current density and the current off-time (t(off)).