This paper presents a 591×438-DPI ultrasonic fingerprint sensor. The sensor is based on a piezoelectric micromachined ultrasonic transducer (PMUT) array that is bonded at wafer-level to complementary metal oxide semiconductor (CMOS) signal processing electronics to produce a pulse-echo ultrasonic imager on a chip. To meet the 500-DPI standard for consumer fingerprint sensors, the PMUT pitch was reduced by approximately a factor of two relative to an earlier design.
View Article and Find Full Text PDFIEEE Trans Ultrason Ferroelectr Freq Control
December 2017
We propose an apodization technique-based composite thin-film bulk acoustic wave resonator (c-FBAR) design to enable the displacement and strain energy confinement at the central section of the resonator while in operation at the resonance mode. Sinc-shaped AlN on Silicon on Insulator apodized c-FBARs is designed to attain close to 90% energy localization. In this paper, a single crystal silicon as the mechanical layer and an AlN piezoelectric material as the transducer layer of the resonator implemented by InvenSense Inc.
View Article and Find Full Text PDFIEEE Trans Ultrason Ferroelectr Freq Control
September 2017
In this paper, we present a single-chip 65 ×42 element ultrasonic pulse-echo fingerprint sensor with transmit (TX) beamforming based on piezoelectric micromachined ultrasonic transducers directly bonded to a CMOS readout application-specific integrated circuit (ASIC). The readout ASIC was realized in a standard 180-nm CMOS process with a 24-V high-voltage transistor option. Pulse-echo measurements are performed column-by-column in sequence using either one column or five columns to TX the ultrasonic pulse at 20 MHz.
View Article and Find Full Text PDFThis paper studies the nonlinear behavior of a nano-optomechanical actuator, consisting of a free-standing arc in a ring resonator that is coupled to a bus waveguide through evanescent waves. The arc deflects when a control light of a fixed wavelength and optical power is pumped into the bus waveguide, while the amount of deflection is monitored by measuring the transmission spectrum of a broadband probe light. This nanoactuator achieves a maximal deflection of 43.
View Article and Find Full Text PDFAluminium-coated micromirrors driven by electrothermal and electromagnetic actuations have been demonstrated for 3-D variable optical attenuation applications. Three types of attenuation schemes based on electrothermal, electromagnetic and hybrid, i.e.
View Article and Find Full Text PDFA novel prototype of an electrothermal chevron-beam actuator based microelectromechanical systems (MEMS) platform has been successfully developed for circumferential scan. Microassembly technology is utilized to construct this platform, which consists of a MEMS chevron-beam type microactuator and a micro-reflector. The proposed electrothermal microactuators with a two-stage electrothermal cascaded chevron-beam driving mechanism provide displacement amplification, thus enabling a highly reflective micro-pyramidal polygon reflector to rotate a large angle for light beam scanning.
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