Publications by authors named "Julian Hesselbach"

The effect of carbon-based additives on adhesives and potting compounds with regard to electrical conductivity and electromagnetic interference (EMI) shielding properties is of great interest. The increasing power of wireless systems and the ever-higher frequency bands place new demands on shielding technology. This publication gives an overview of the effect of carbon-based fillers on electrical conductivity, electromagnetic shielding properties, and the influence of different fillers and filler amounts on rheological behavior.

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