Novel copper-nickel matrix composites reinforced with silicon carbide (SiC) micro particles for metal contact applications were manufactured by powder metallurgy technology and were experimentally characterized. Cu and Cu alloys are commonly used as metal contact for either vacuum, oil, or SF6 in low-voltage circuit breaker devices, but their application in environments with the presence of oxygen is limited due to their tendency to form high-resistance copper oxides. Thus, the addition of Ni as an alloying element provides resistance to both humidity and several corrosive environments and increases the composites' hardness, mechanical strength, and wear resistance.
View Article and Find Full Text PDFDimensional analysis through the Buckingham Pi theorem was confirmed as an efficient mathematical tool to model the otherwise non-linear high order ultrasonic micro-injection molding process (UMIM). Several combinations of processing conditions were evaluated to obtain experimental measurements and validate the derived equations. UMIM processing parameters, output variable energy consumption, and final specimen's Young modulus were arranged in dimensionless groups and formulated as functional relationships, which lead to dimensionless equations that predict output variables as a function of the user-specified processing parameters and known material properties.
View Article and Find Full Text PDFThis research focuses on investigating how physical and mechanical properties of polypropylene (PP) recycled material are modified when ultrasonic micro injection molding (UMIM) technology is used to produce material specimens. Experimental characterization by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), Fourier transform infrared (FTIR) spectra, and rheology tests show that the fabricated PP samples were able to withstand up to five times recycled processing before some signs of mechanical and physical properties degradation are observed. Surprisingly, uniaxial extension tests show an increase of 3.
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