Fabrication of a multilevel Fresnel axicon deep in fused silica by femtosecond laser machining.

This manuscript presents a simple approach to the manufacturing and optimization of a multilevel phase-only diffractive conical lens (Fresnel axicon or "fraxicon"). The method for recording deep type I modifications in fused silica was established and its ability proven. We showed the prospects and limitations of elements processed using this method.

Effect of Femtosecond Laser-Irradiated Titanium Plates on Enhanced Antibacterial Activity and Preservation of Bacteriophage Stability.

Titanium (Ti) is widely recognized for its exceptional properties and compatibility with medical applications. In our study, we successfully formed laser-induced periodic surface structures (LIPSS) on Ti plates with a periodicity of 520-740 nm and a height range of 150-250 nm. To investigate the morphology and chemical composition of these surfaces, we employed various techniques, including field emission scanning electron microscopy, energy dispersive X-ray spectroscopy, atomic force microscopy, X-ray photoelectron spectroscopy, and Raman spectroscopy.

Investigation of the modifications properties in fused silica by the deep-focused femtosecond pulses.

In this study, we demonstrate the elongated Type I modifications in fused silica with an axial length > 50 µm. Such extended longitudinal dimensions were obtained by deep focusing radiation of a femtosecond laser inside fused silica at a depth of 2 mm. The transition from the Type II modification (nanogratings) to the Type I modification (refraction index change) was observed with increasing focusing depth at the constant pulse energy.

Improvement of Etching Anisotropy in Fused Silica by Double-Pulse Fabrication.

Femtosecond laser-induced selective etching (FLISE) is a promising technology for fabrication of a wide range of optical, mechanical and microfluidic devices. Various etching conditions, together with significant process optimisations, have already been demonstrated. However, the FLISE technology still faces severe limitations for a wide range of applications due to limited processing speed and polarization-dependent etching.